Product Summary

The LE80536GC0332M is an OEM/tray microprocessor. It utilizes a new microarchitecture to meet the current and future demands of high-performance, low-power embedded computing, making the LE80536GC0332M ideal for communications, transaction terminal, interactive client, and industrial automation applications. The LE80536GC0332M expands the processor’s performance and I/O bandwidth capability for embedded computing, particularly within the communications market segment. It provides up to 4 GB single- or dual- channel DDR 200 memory, and features configurable, optional Error Correcting Code (ECC) operation.

Parametrics

LE80536GC0332M general specifications: (1)V core (V):1.276V to 1.34V; (2)Minimum/Maximum operating temperature:0℃ to 100℃; (3)Minimum/Maximum power dissipation:1.87W (Deeper Sleep mode)/30.22W; (4)Thermal Design Power:21W; (5)core speed:1.8GHz; (6)external bus speed:400MHz; (7)L2 cache:2MB.

Features

LE80536GC0332M features: (1)AutoHALT mode; (2)Stop Grant mode; (3)Sleep mode; (4)Deep Sleep mode; (5)Deeper Sleep mode; (6)Dynamic FSB power down; (7)Enhanced SpeedStep technology; (8)MMX technology; (9)SSE; (10)SSE2; (11)Efficient execution:Advanced branch prediction, Power optimized processor system bus, Micro-op fusion, Hardware stack manager; (12)Power-optimized circuitry: Cache and processor bus power management, Next-generation Intel SpeedStep technology; (13)Data supply:Large L1/L2 caches; (14)High I/O bandwidth:Intel E7501 chipset supports up to six PCI-X segments; (15)Graphics support:Intel 855GME chipset provides integrated graphics support via Intel Extreme Graphics 2 Technology.

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